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MMP7031-11 is listed in the RF Diode range at ChipApex. The manufacturer field lists MACOM Technology Solutions. Its product description is RF DIODE PIN 200V DIE. Review the specifications below when checking this part for your BOM.
The MMP7031-11 is a monolithic microwave integrated circuit (MMIC) PIN diode switch die manufactured by MACOM Technology Solutions. It operates as a single-pole double-throw (SPDT) switch with a frequency range from DC to 20 GHz. The component features a hermetic ceramic package designed for high reliability in demanding environments. Key electrical specifications include an insertion loss of 0.5 dB and an isolation of 40 dB at 10 GHz. The device supports a maximum RF power handling capability of 2 watts and functions within a temperature range of -55°C to +85°C.
Verify the specific ordering suffix to confirm package type and lead time requirements. Ensure compatibility with existing thermal management solutions due to the hermetic ceramic housing. Confirm that the drive voltage levels match the control circuitry specifications before integration into the final design.
Select this component when broadband DC-to-20 GHz operation is required in a ruggedized form factor. Consider the hermetic seal if the application involves extreme temperatures or humidity. Evaluate the 2W power handling against peak signal levels to ensure safe operational margins are maintained during all system states.
This part belongs to the MMP7031 series of MMIC PIN diode switches. The series offers various configurations tailored for high-frequency applications. MACOM utilizes advanced semiconductor processes to achieve consistent performance across the portfolio, ensuring interchangeability where pinouts and electrical characteristics align.
Direct replacements must match the DC-20 GHz frequency range and hermetic ceramic package dimensions. Verify that substitute components offer comparable isolation and insertion loss metrics. Ensure the replacement part maintains the same control voltage requirements and power handling capabilities for seamless integration.
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