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MPC8541PXALF is listed in the Microprocessors range at ChipApex. The manufacturer field lists Freescale Semiconductor. Its product description is IC MPU MPC85XX 667MHZ 783FCPBGA. Review the specifications below when checking this part for your BOM.
The MPC8541PXALF is a 32-bit PowerQUICC III integrated communications processor based on the PowerPC e500 core. It operates at a clock frequency of 667 MHz and utilizes a 1.2V supply voltage. The device is housed in a 783-ball FCPBGA package with dimensions of 29x29 mm. Key architectural features include an integrated floating-point unit, boundary scan support, and low-power modes for sleep state operation. It supports a 36-bit address bus width and a 64-bit external data bus width.
Verify the manufacturer origin, as the part was originally produced by Freescale Semiconductor and is now under NXP Semiconductors. Confirm RoHS compliance status and lead-free specifications. Ensure the package type matches the required 783-ball FCPBGA form factor. Check for any specific ordering suffixes that may indicate temperature range or packaging variations.
Select this component for applications requiring a 32-bit RISC processor with integrated communication peripherals. Consider the 667 MHz operating speed and 1.2V power requirements when designing the system. Evaluate the need for floating-point processing and boundary scan support. Ensure compatibility with the 783-ball FCPBGA footprint and thermal management solutions suitable for the specified package size.
This processor belongs to the MPC85xx family of PowerQUICC III devices. These processors are designed for high-performance embedded networking and telecommunications applications. The MPC8541 variant specifically integrates the e500 core with necessary system logic, offering a balance of processing power and peripheral integration for cost-sensitive yet demanding network environments.
Consult official NXP documentation for direct pin-to-pin compatible replacements within the MPC85xx series. Verify functional equivalence regarding clock speeds, voltage levels, and package dimensions before substitution.
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