Memory IC MSQ220BJC288-12 product image

MSQ220BJC288-12

  • Description:IC SRAM 512MBIT PAR 288FCBGA
  • Series:-
  • Mfr:MoSys, Inc.
  • Package:Tray

SKU:dc38db8a3294 Category: Brand:

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MSQ220BJC288-12 is listed in the Memory IC range at ChipApex. The manufacturer field lists MoSys, Inc.. Its product description is IC SRAM 512MBIT PAR 288FCBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MSQ220BJC288-12

  • Description:IC SRAM 512MBIT PAR 288FCBGA
  • Series:-
  • Mfr:MoSys, Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM, RLDRAM
  • Memory Size:512Mbit
  • Memory Organization:144M x 4
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:288-BGA, FCBGA
  • Supplier Device Package:288-FCBGA (19x19)
  • Access Time:3.2 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MSQ220BJC288-12

MSQ220BJC288-12

Memory IC Overview

The MSQ220BJC288-12 is a static random-access memory integrated circuit manufactured by MoSys, Inc. It provides a storage capacity of 512 megabits organized in a parallel interface configuration. The device is housed in a 288-pin Fine-Pitch Ball Grid Array (FCBGA) package designed for surface-mount assembly. This component functions as a high-speed memory solution suitable for demanding digital signal processing and data buffering applications requiring reliable parallel data access.

Memory IC Feature Summary

  • Provides 512-megabit non-volatile-like persistent storage capability within a volatile SRAM architecture
  • Utilizes a parallel interface for direct data bus connectivity
  • Engineered with a 288-pin FCBGA form factor for compact board integration

Memory IC Applications

  • Digital signal processing systems
  • Data buffering and caching layers
  • High-performance embedded computing platforms

Memory IC Procurement Notes

Verify the specific suffix designation to confirm pinout and speed grade compatibility. Ensure the supplier provides traceability documentation for the 288-pin FCBGA package. Confirm that the source material explicitly identifies MoSys, Inc. as the manufacturer rather than a distributor or assembler. Validate the 512Mbit density specification against official datasheets before procurement.

Memory IC Selection Notes

Select this component when a parallel interface SRAM with 512Mbit density is required. The 288-pin FCBGA package dictates specific PCB layout constraints regarding ball pitch and thermal management. Consider the operating temperature range and voltage requirements specified in the official documentation to ensure system compatibility.

Memory IC Part Context

This part belongs to the MSQ220 series of SRAM devices from MoSys, Inc. The series typically offers high-density memory solutions in various package configurations. The BJC288 variant specifically denotes the 288-pin Fine-Pitch Ball Grid Array housing. The -12 suffix generally indicates a specific speed bin or timing characteristic defined by the manufacturer.

MSQ220BJC288-12MSQ220BJC288-12

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