Memory IC MT46H64M32LFCX-48 WT:B TR product image

MT46H64M32LFCX-48 WT:B TR

$5.75
  • Description:IC DRAM 2GBIT PAR 208MHZ 90VFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)

SKU:1e4486a62236 Category: Brand:

  
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MT46H64M32LFCX-48 WT:B TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 2GBIT PAR 208MHZ 90VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT46H64M32LFCX-48 WT:B TR

  • Description:IC DRAM 2GBIT PAR 208MHZ 90VFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR
  • Memory Size:2Gbit
  • Memory Organization:64M x 32
  • Memory Interface:Parallel
  • Clock Frequency:208 MHz
  • Write Cycle Time - Word, Page:14.4ns
  • Voltage - Supply:1.7V ~ 1.95V
  • Operating Temperature:-25°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:90-VFBGA
  • Supplier Device Package:90-VFBGA (9x13)
  • Access Time:5 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT46H64M32LFCX-48 WT:B TR

MT46H64M32LFCX-48 WT:B TR

Memory IC Overview

The MT46H64M32LFCX-48 WT:B TR is a Mobile Low-Power DDR SDRAM IC manufactured by Micron Technology. It provides a total storage capacity of 2Gb, organized as 16 Meg x 32 across four internal banks. The device operates with a VDD/VDDQ supply voltage range of 1.70V to 1.95V and supports a clock rate of 185 MHz with an access time of 5.0ns at CL=3. It utilizes a 90-ball VFBGA package (9mm x 13mm) and is rated for the Wireless temperature range (-25°C to +85°C).

Memory IC Feature Summary

  • Features an internal pipelined double data rate architecture enabling two data accesses per clock cycle.
  • Supports bidirectional data strobes per byte of data for edge-aligned reads and center-aligned writes.
  • Includes programmable burst lengths and concurrent auto precharge options for flexible operation.

Memory IC Applications

  • Mobile wireless communication devices
  • Portable consumer electronics requiring low power consumption
  • Embedded systems utilizing mobile memory interfaces

Memory IC Procurement Notes

Verify the specific ordering suffixes against official Micron documentation to confirm package type, speed grade, and temperature rating. Ensure compatibility with system voltage requirements and interface standards before integration. Confirm availability status directly with authorized distributors or the manufacturer due to potential lifecycle changes.

Memory IC Selection Notes

Select this component when a 2Gb density with a 32-bit data bus width is required for mobile applications. The -48 speed grade offers a balance between performance and power efficiency suitable for wireless environments. Consider the 90-ball VFBGA footprint constraints during PCB layout design.

Memory IC Part Context

This part belongs to the Micron Mobile LPDDR family, designed for high-speed, low-power memory applications in portable devices. It shares architectural similarities with other variants in the series but differs in organization, package, and timing specifications.

Memory IC Replacement Considerations

Check for direct substitutes within the same family such as MT46H64M32LF variants with different speed grades or packages. Verify pinout and electrical compatibility before substituting.

Memory IC FAQ

What is the CAS latency for this device?

The datasheet specifies key timing parameters at CL = 3.

Does this part support differential clock inputs?

Yes, the device features differential clock inputs (CK and CK#).

MT46H64M32LFCX-48 WT:B TRMT46H64M32LFCX-48 WT:B TR
$5.75
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