Memory IC MT53D512M32D2DS-046 IT:D TR product image

MT53D512M32D2DS-046 IT:D TR

$9.35
  • Description:IC DRAM 16GBIT 2.133GHZ 200WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR),Tape & Reel (TR)

SKU:771ffc1add75 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

MT53D512M32D2DS-046 IT:D TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Micron Technology Inc.. Its product description is IC DRAM 16GBIT 2.133GHZ 200WFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for MT53D512M32D2DS-046 IT:D TR

  • Description:IC DRAM 16GBIT 2.133GHZ 200WFBGA
  • Series:-
  • Mfr:Micron Technology Inc.
  • Package:Tape & Reel (TR),Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR4
  • Memory Size:16Gbit
  • Memory Organization:512M x 32
  • Memory Interface:-
  • Clock Frequency:2.133 GHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.1V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:200-WFBGA
  • Supplier Device Package:200-WFBGA (10x14.5)
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for MT53D512M32D2DS-046 IT:D TR

MT53D512M32D2DS-046 IT:D TR

Memory IC Overview

The Micron MT53D512M32D2DS-046 IT:D TR is a Low Power Double Data Rate Type 4 (LPDDR4) SDRAM component. It features a total storage capacity of 16 Gbit, organized as two banks of 512 Megabit by 32 bits each. The device supports a maximum clock frequency of 2.133 GHz, enabling high-speed data transfer rates. It utilizes a WFBGA-200 package with dimensions of 10mm x 14.5mm. The operational temperature range extends from -40°C to +105°C, suitable for demanding mobile and industrial environments.

Memory IC Feature Summary

  • Supports dual-die stacking architecture for increased density within a compact footprint
  • Features low voltage operation for enhanced power efficiency in mobile applications
  • Includes built-in temperature sensors and ZQ calibration for system reliability

Memory IC Applications

  • Smartphones and mobile communication devices
  • Tablets and portable computing platforms
  • Automotive infotainment systems

Memory IC Procurement Notes

Verify the specific suffix 'IT:D' against official Micron documentation to confirm the exact temperature grade and speed bin. Ensure the ordering code matches the required reel packaging format. Cross-reference the datasheet revision date to guarantee compatibility with current design specifications and regulatory standards.

Memory IC Selection Notes

Select this component when a 16 Gbit LPDDR4 solution with a 32-bit bus width is required. The -40°C to +105°C operating range makes it appropriate for automotive or ruggedized mobile designs. Confirm that the host controller supports the 2.133 GHz data rate and the WFBGA-200 form factor constraints.

Memory IC Part Context

This part belongs to Micron's LPDDR4 family, designed for next-generation mobile applications requiring high bandwidth and low power consumption. The MT53D series typically integrates multiple dies to achieve higher densities while maintaining a small physical profile, catering to space-constrained electronic devices.

Memory IC Replacement Considerations

Consult Micron's official substitution guides for verified alternatives. Generic cross-references may not match the specific electrical characteristics or pinout configurations required for this dual-die configuration.

MT53D512M32D2DS-046 IT:D TRMT53D512M32D2DS-046 IT:D TR
$9.35
Buy Now

Recent News