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N13SP2R5L is listed in the Inrush Current Limiters (ICL) range at ChipApex. The manufacturer field lists YAGEO. Its product description is ICL 2.5 OHM 15% 6A 13MM. Review the specifications below when checking this part for your BOM.
The YAGEO N13SP2R5L is a Negative Temperature Coefficient (NTC) thermistor belonging to the SP series, designed for inrush current limiting applications. It features a nominal resistance of 2.5 Ohms with a tolerance of ±15%. The component has a power rating of 3 W and a steady-state current rating of 6 A. It utilizes radial leads with a spacing of 7.5 mm for PCB mounting. The physical dimensions include a diameter of 16 mm and a width of 6 mm. The operating temperature range extends from -40°C to +200°C.
Verify the specific ordering suffix against official documentation to confirm tolerance and packaging details. Ensure the selected variant matches the required resistance tolerance and lead configuration for the target PCB layout. Cross-reference the manufacturer's latest datasheet to confirm compliance with RoHS directives and other relevant environmental standards before finalizing procurement orders.
Select this component based on the circuit's peak inrush current requirements and the desired steady-state operating current. Verify that the thermal dissipation characteristics align with the ambient temperature conditions of the application. Confirm that the physical footprint and lead spacing are compatible with the printed circuit board design constraints.
This part belongs to the YAGEO SP series of NTC thermistors, which are specialized for protecting electronic circuits against excessive initial charging currents. These components are commonly integrated into AC/DC converters and industrial power systems where reliable surge suppression is critical for maintaining system stability and component longevity.
Direct substitutes must match the 2.5 Ohm resistance, 6 A current rating, and 3 W power rating. Verify equivalent thermal time constants and physical dimensions to ensure compatibility with existing PCB footprints and thermal management strategies.
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