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NBPMANN150PGUNV is listed in the Pressure Sensors Transducers range at ChipApex. The manufacturer field lists Honeywell Sensing and Productivity Solutions. Its product description is SENSOR 150PSIG 0.11" .13V. Review the specifications below when checking this part for your BOM.
The Honeywell NBPMANN150PGUNV is a board-mount pressure sensor from the NBP series, designed for vented gauge pressure measurement. It features a working pressure of 150 PSI (1034.21 kPa) and a maximum pressure rating of 240 PSI (1654.74 kPa). The device utilizes a Wheatstone bridge output, providing a signal range of 0 mV to 130 mV at a 5V supply. It operates within a temperature range of -40°C to 125°C and supports supply voltages between 1.8V and 12V. The component achieves an accuracy of ±0.25% and is housed in a 4-SMD J-Lead package with a top port.
Verify that the specific suffix PGUNV corresponds to the required barbed port style and J-lead termination configuration. Confirm that the vented gauge pressure type aligns with the system's reference requirements. Ensure the supply voltage constraints fit within the 1.8V to 12V operational window. Check for RoHS compliance status if environmental regulations apply to the final assembly.
Select this component when high accuracy and wide voltage tolerance are critical for board-level integration. The NBP series offers superior stability compared to basic sensors. Consider the J-lead package for automated surface mount assembly processes. Evaluate the 150 PSI working pressure against peak system loads to ensure adequate safety margins.
This part belongs to the Honeywell NBP series of basic board-mount pressure sensors. The series is characterized by its silicon piezoresistive technology and integrated signal conditioning. These sensors are engineered for cost-effective, high-volume applications requiring reliable pressure data acquisition in compact form factors.
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing PCB footprints and electrical interfaces before considering alternative components.
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