Single FETs, MOSFETs NDS356P product image

NDS356P

  • Description:MOSFET P-CH 20V 1.1A SUPERSOT3
  • Series:-
  • Mfr:onsemi
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:198450bb2baf Category: Brand:

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NDS356P is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET P-CH 20V 1.1A SUPERSOT3. Review the specifications below when checking this part for your BOM.

Single FETs, MOSFETs specifications for NDS356P

  • Description:MOSFET P-CH 20V 1.1A SUPERSOT3
  • Series:-
  • Mfr:onsemi
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • FET Type:P-Channel
  • Technology:MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss):20 V
  • Current - Continuous Drain (Id) @ 25°C:1.1A (Ta)
  • Drive Voltage (Max Rds On, Min Rds On):4.5V, 10V
  • Rds On (Max) @ Id, Vgs:210mOhm @ 1.3A, 10V
  • Vgs(th) (Max) @ Id:2.5V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs:5 nC @ 5 V
  • Vgs (Max):±12V
  • Input Capacitance (Ciss) (Max) @ Vds:180 pF @ 10 V
  • FET Feature:-
  • Power Dissipation (Max):500mW (Ta)
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Supplier Device Package:SOT-23-3
  • Package / Case:TO-236-3, SC-59, SOT-23-3

Single FETs, MOSFETs datasheet and documents for NDS356P

NDS356P

Single FETs, MOSFETs Overview

The NDS356P is a P-Channel Logic Level Enhancement Mode Field Effect Transistor manufactured by onsemi. It features a maximum drain-source voltage of -20 V and a continuous drain current of ±1.1 A. The device utilizes high cell density DMOS technology to achieve an extremely low static drain-source on-resistance (RDS(ON)) of 0.3 Ω at VGS = -4.5 V and 0.21 Ω at VGS = -10 V. Packaged in a compact SOT-23 surface mount outline, it supports an operating temperature range from -55°C to 150°C.

Single FETs, MOSFETs Feature Summary

  • Logic level enhancement mode operation enables direct drive from standard logic interfaces for efficient switching.
  • High-density DMOS cell design minimizes on-state resistance to reduce inline power loss.
  • Proprietary package construction incorporates a copper lead frame to enhance thermal dissipation capabilities.

Single FETs, MOSFETs Applications

  • Notebook computer power management
  • Portable electronics circuits
  • Battery powered applications requiring fast high-side switching

Single FETs, MOSFETs Procurement Notes

Verify the manufacturer origin as Fairchild Semiconductor or onsemi due to corporate integration history. Confirm the specific revision status against the datasheet Rev. E1 documentation. Ensure the component matches the SOT-23 physical footprint and pinout configuration required for the target PCB layout.

Single FETs, MOSFETs Selection Notes

Select this component when low voltage logic control is required for high-side switching applications. The logic level threshold allows compatibility with standard gate drive voltages while maintaining low conduction losses. Evaluate the thermal resistance requirements based on the specific board copper pad area available for heat dissipation.

Single FETs, MOSFETs Part Context

This device belongs to the PowerTrench family of power field effect transistors. It represents a generation of components optimized for small outline surface mount packages where space constraints and thermal efficiency are critical design factors for portable electronic systems.

Single FETs, MOSFETs Replacement Considerations

FDN358P

Single FETs, MOSFETs FAQ

What is the maximum continuous drain current rating?

The maximum continuous drain current is rated at ±1.1 A under specified conditions.

How does the on-resistance vary with temperature?

The static drain-source on-resistance increases as the junction temperature rises, reaching a maximum of 0.4 Ω at 125°C when tested at VGS = -4.5 V.

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