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OP01GJ is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC OPAMP GP 1 CIRCUIT TO99-8. Review the specifications below when checking this part for your BOM.
The OP01GJ is a precision operational amplifier manufactured by Analog Devices Inc. It features a voltage-feedback architecture housed in an 8-pin TO-99 metal can package (MBCY8). Key electrical specifications include a maximum input offset voltage of 5000 µV and a bandwidth of 2.5 MHz. The device operates with a nominal supply voltage of ±15 V, supporting a range up to ±20 V. It exhibits a maximum bias current of 0.1 µA at 25°C and offers a typical common-mode rejection ratio of 100 dB. The component is internally frequency compensated.
Verify the specific suffix 'GJ' against official Analog Devices documentation to confirm pinout compatibility and material composition. Ensure that the TO-99 package dimensions match the target footprint requirements. Confirm RoHS compliance status as indicated in the source data, noting potential restrictions on lead content for specific manufacturing batches or regions.
Select this component when a hermetic metal-can package is required for environmental protection alongside precision amplification. The 2.5 MHz bandwidth and 5000 µV max offset voltage define its performance envelope. Consider the ±15 V nominal supply requirement and 0.1 µA bias current when designing power and input stages for high-impedance sources.
The OP01 series represents a family of precision operational amplifiers from Analog Devices. The OP01GJ variant specifically denotes the TO-99 package configuration within this lineup. This packaging option provides superior thermal and mechanical stability compared to plastic packages, making it suitable for aerospace and military applications where long-term reliability is paramount.
Direct substitutes must maintain the TO-99 8-pin package and similar electrical parameters. Verify pin-to-pin compatibility before substitution. Alternative packages such as SOIC or DIP require schematic redesign due to differing pinouts and physical dimensions.
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