— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:HIGH POWER CHIP ATTENUATOR, 10DB
- Series:PAT
- Mfr:Susumu
- Package:Tape & Reel (TR),Cut Tape (CT)
- Attenuation Value:10dB
- Frequency Range:0 Hz ~ 6 GHz
- Power (Watts):5W
- Impedance:50 Ohms
- Grade:-
- Qualification:-
- Package / Case:2-SMD, No Lead
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Overview
The PAT3060H-C-10DB-T1 is a high power chip attenuator manufactured by Susumu. It provides a fixed attenuation of 10 dB with a nominal impedance of 50 Ohms. The component supports a frequency range from DC to 6 GHz and handles a rated power of 5 W. It utilizes silicon technology and features a 2412 surface mount package (2-SMD, No Lead). The device operates within a temperature range of -55°C to +125°C.
Feature Summary
- High power handling capability for demanding RF applications
- Wideband operation covering DC to 6 GHz frequencies
- Robust thermal performance suitable for high-temperature environments
Applications
- RF signal path power management
- Test and measurement equipment calibration
- Wireless communication system protection
Procurement Notes
Verify the specific suffix T1 corresponds to the required tape and reel packaging configuration. Confirm that the 5W power rating aligns with the thermal dissipation requirements of the target application environment. Ensure the 2412 footprint matches the PCB layout constraints before finalizing procurement orders.
Selection Notes
Select this component when high power dissipation is critical in a compact SMD form factor. The 10dB attenuation value is fixed; verify it meets the circuit design requirements. Consider the 50 Ohm impedance match for standard RF systems. Evaluate the thermal management needs given the 5W rating and operating temperature limits.
Part Context
This part belongs to the PAT series of high power chip attenuators from Susumu. It is designed for applications requiring significant power handling in a small surface-mount package. The series offers various attenuation values and power ratings to suit different RF system architectures.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation.
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