QSE-028-01-L-D-DP-GP

QSE-028-01-L-D-DP-GP is listed in the Arrays, Edge Type, Mezzanine (Board To Board) range at ChipApex. The manufacturer field lists Samtec Inc.. Its product description is CONN DIFF ARRAY RCP 56P SMD GOLD. Review the specifications below when checking this part for your BOM.

Arrays, Edge Type, Mezzanine (Board To Board) specifications for QSE-028-01-L-D-DP-GP

• Description：CONN DIFF ARRAY RCP 56P SMD GOLD
• Series：Q Strip® QSE
• Mfr：Samtec Inc.
• Package：Tray
• Connector Type：Differential Pair Array, Female
• Number of Positions：56
• Pitch：0.031" (0.80mm)
• Number of Rows：2
• Mounting Type：Surface Mount
• Features：Ground Bus (Plane), Mating Flange
• Contact Finish：Gold
• Contact Finish Thickness：10.0µin (0.25µm)
• Mated Stacking Heights：5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm
• Height Above Board：0.128" (3.25mm)

Arrays, Edge Type, Mezzanine (Board To Board) datasheet and documents for QSE-028-01-L-D-DP-GP

Explore related parts through Rectangular Connectors, Connectors, Interconnects, all product categories, ChipApex homepage.