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S29GL512S10DHI020 is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC FLASH 512MBIT PARALLEL 64FBGA. Review the specifications below when checking this part for your BOM.
The Infineon S29GL512S10DHI020 is a 512 Mbit Parallel NOR Flash memory device utilizing 65-nm MIRRORBIT Eclipse technology. It features a 16-bit data bus and operates on a single 3.0 V supply (2.7 V to 3.6 V). The component provides a maximum random access time of 100 ns and a page access time of 15 ns. It includes a 512-byte write buffer for efficient programming, supports asynchronous reads, and offers advanced sector protection with automatic error correction capabilities.
Verify the specific ordering suffix against the manufacturer's current datasheet to confirm package type, temperature grade, and availability status. Ensure compatibility with system voltage requirements and interface timing specifications before integration. Cross-reference part numbers with official Infineon documentation to avoid discrepancies in pinouts or electrical characteristics.
Select this component for designs requiring fast random access and efficient block programming via the write buffer. Consider the 16-bit bus width and versatile I/O voltage range when interfacing with host controllers. Evaluate the need for advanced sector protection and ECC features based on data integrity requirements. Confirm that the industrial temperature range meets the operational environment constraints.
This device belongs to the GL-S family of MIRRORBIT Eclipse flash memories, which combines XIP speed with data storage density. The family utilizes a uniform 128-kbyte sector architecture and supports common flash interface standards for driver flexibility. It is designed for robust performance in demanding embedded systems requiring reliable non-volatile storage.
Consult official Infineon documentation for verified substitute part numbers within the GL-S series. Ensure any replacement matches the required density, interface type, and package dimensions. Verify that alternative components meet the same electrical and environmental specifications.
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