SEA01

Overview

The SEA01 is a high-performance, low-power System-in-Package (SiP) module developed by STMicroelectronics. It integrates an STM32 microcontroller unit with a multi-mode cellular modem and GNSS capabilities into a compact form factor. Designed for IoT applications requiring reliable connectivity and location services, the module supports various wireless standards including LTE-M, NB-IoT, and GPS/Galileo. The integrated design simplifies hardware development while ensuring robust performance in diverse environmental conditions.

Feature Summary

• Integrated cellular and GNSS connectivity within a single package
• Optimized for low-power operation suitable for battery-driven devices
• Supports multiple global frequency bands for worldwide deployment

Applications

• Asset tracking and logistics monitoring
• Smart metering and utility infrastructure
• Wearable health and fitness devices
• Industrial sensor networks

Procurement Notes

Verify the specific revision level and antenna configuration required for your target market's regulatory compliance. Ensure compatibility with the host system's power supply rails and interface protocols before integration. Consult official documentation for detailed pinout definitions and thermal management guidelines to ensure optimal module performance.

Selection Notes

Choose this module when space constraints preclude discrete component solutions but full cellular and GNSS functionality is required. It is ideal for developers seeking to reduce time-to-market by leveraging a pre-certified platform. Consider power consumption profiles against application duty cycles to maximize battery life.

Part Context

This module belongs to STMicroelectronics' portfolio of connected device solutions, bridging the gap between simple microcontrollers and complex standalone modems. It leverages ST's expertise in both MCU and RF technologies to provide a unified solution for the growing Internet of Things ecosystem.

Replacement Considerations

Direct replacements may include other ST SiP modules or third-party equivalents offering similar LTE-M/NB-IoT and GNSS integration. Verify mechanical footprint and pin compatibility if substituting with non-ST components.