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SI82F99ECC-IS1 is listed in the Isolators - Gate Drivers range at ChipApex. The manufacturer field lists Skyworks Solutions Inc.. Its product description is 3.75 KV 2-CHANNEL ISOLATED SELVC. Review the specifications below when checking this part for your BOM.
The SI82F99ECC-IS1 is a dual-channel isolated gate driver from Skyworks Solutions, designed for driving power switches including Silicon MOSFETs, IGBTs, SiC, and GaN devices. It features a 3.75 kV isolation rating and operates within a supply voltage range of 3 V to 20 V on the input side, while supporting output voltages from 5 V to 30 V. The device utilizes CMOS logic and provides non-inverting configurations with rise and fall times of 17 ns and 22 ns respectively. It functions reliably across an operating temperature range of -40°C to +125°C and is housed in a SOIC-16 package.
Verify component authenticity through authorized Skyworks distributors or official channels. Confirm that the specific suffix matches the required isolation and pinout specifications. Ensure storage conditions comply with moisture sensitivity levels prior to surface mount assembly. Cross-reference datasheet revisions to guarantee compatibility with current design requirements.
Select this component when dual-channel isolation with 3.75 kV rating is required for mixed-signal power stages. Consider the SOIC-16 footprint for PCB layout constraints. Evaluate thermal performance at maximum operating temperatures. Verify that the 17 ns/22 ns transition speeds meet the system's switching frequency demands without excessive losses.
This part belongs to the SI82Fx family of isolated gate drivers. It complements other variants like the SI82F99EEC-IS1R by offering similar electrical characteristics but potentially different packaging or reel options. The series focuses on providing robust isolation for next-generation power electronics, bridging control logic with high-power switching elements.
Direct substitutes include the SI82F99EEC-IS1R, which shares identical electrical parameters and functionality. Ensure any replacement maintains the same SOIC-16 package dimensions and pin configuration to fit existing footprints without redesign.
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