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SI8661EC-B-IS1 is listed in the Digital Isolators range at ChipApex. The manufacturer field lists Skyworks Solutions Inc.. Its product description is DGTL ISOLTR 3.75KV 6CH GP 16SOIC. Review the specifications below when checking this part for your BOM.
The SI8661EC-B-IS1 is a six-channel digital isolator from the Si866x series, manufactured by Skyworks Solutions. It features capacitive coupling technology with a 3750 Vrms insulation voltage and supports data rates up to 150 Mb/s. The device operates within a supply voltage range of 2.375 V to 5.5 V and includes five forward channels and one reverse channel. It exhibits a propagation delay of 8 ns and common mode transient immunity of 35 kV/µs. Qualified under AEC-Q100 standards, it functions between -40°C and +125°C in a 16-pin SOIC-Narrow package.
Verify the specific suffix IS1 corresponds to the narrow SOIC-16 package and lead-free status. Confirm AEC-Q100 automotive qualification requirements match your design specifications. Check moisture sensitivity levels and reflow soldering profiles during assembly planning. Ensure voltage ratings align with system isolation barriers.
Select this component when automotive-grade reliability and high-speed digital isolation are required. Compare against other Si866x variants based on insulation voltage and channel directionality. Consider power consumption and package dimensions for PCB layout constraints. Validate thermal performance within the specified operating temperature range.
This part belongs to the Si866x family of digital isolators, designed for general-purpose applications requiring high reliability. The EC suffix indicates automotive qualification, while B denotes specific electrical characteristics. The IS1 suffix specifies the narrow SOIC-16 package type. This series replaces older technologies with superior performance metrics.
SI8661BC-B-IS1 offers similar specifications but may differ in packaging or specific electrical tolerances. Verify channel configuration and insulation ratings before substitution. Ensure compatibility with existing board layouts and thermal management strategies.
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