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SL 1 179 27 Z is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is ONE ROW, 0.635 MM. Review the specifications below when checking this part for your BOM.
The SL 1 179 27 Z is a single-row board-to-board stacking connector manufactured by Fischer Elektronik. It features 27 positions with a 0.100 inch (2.54 mm) pin spacing. The component utilizes through-hole termination and tin-plated contacts. Key dimensions include an overall pin length of 0.945 inches, a mating column length of 0.433 inches, and a solder tail length of 0.130 inches. The housing is black, and the contact surface thickness is specified at 157.5 microinches.
Verify the specific ordering suffix 'Z' against the manufacturer's current datasheet to confirm plating specifications and material composition. Ensure compatibility with mating headers regarding pin length and row configuration. Cross-reference the Digikey part number 5496-sl1309736z-nd if available, though direct manufacturer documentation remains the primary source for technical validation.
Select this component when a single-row, 27-position interface with 2.54 mm pitch is required. The tin plating suits general-purpose applications where gold plating is unnecessary. Verify that the 0.433-inch mating height aligns with the target stack-up requirements. Confirm that through-hole assembly processes are compatible with the 0.130-inch solder tail design.
This part belongs to the SL 1 series of Fischer Elektronik connectors, designed for board stacking. The series offers various pin counts and configurations. The SL 1 179 27 Z specifically provides a mid-range position count suitable for moderate-density interconnections. It shares dimensional characteristics with other parts in the SL 1 family, such as consistent pin lengths and spacing standards.
Direct substitutes within the same series include SL 1 179 20 G or SL 1 179 32 S, differing only in pin count. Ensure any replacement maintains the 2.54 mm pitch and single-row layout. Verify that contact plating differences do not impact application performance.
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