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SL 10 SMD 130 10 G B TR is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is 0.635 MM, SMD-TECHIQUE S. Review the specifications below when checking this part for your BOM.
The SL 10 SMD 130 10 G B TR is a board connector from Fischer Elektronik featuring 10 contacts in a single row. It utilizes a male header configuration with a 2.54 mm pitch spacing for surface mount installation. The component employs a staggered contact arrangement and is constructed with copper-tin alloy contacts finished with gold plating on the mating interface. Designed for board-to-board or wire-to-board connections, it supports pick-and-place assembly via tape and reel packaging containing 250 pieces per reel.
Verify that the ordering suffix 'G' corresponds to gold plating and 'B TR' indicates the specific tape and reel packaging format as defined by Fischer Elektronik. Confirm the contact count matches the '10' designation within the 130 series dimensional constraints. Ensure compatibility with standard surface mount reflow profiles and check for any specific handling requirements associated with the reel diameter and packing method.
Select this component when a surface mount male header with a 2.54 mm pitch is required for high-density applications. The staggered configuration allows for reduced footprint compared to straight arrangements. Gold plating ensures durability for repeated mating cycles. Verify that the 10-contact length fits the available board area and aligns with the intended mechanical mounting orientation.
This part belongs to the Fischer Elektronik SL 10 SMD series of surface mount male headers. The series offers various contact counts ranging from 4 to 20 positions, accommodating different circuit density needs. The 130 series designations typically correlate with specific physical dimensions and housing lengths, ensuring standardized mechanical integration across the product line.
Direct substitutes must match the 2.54 mm pitch, 10-position count, surface mount orientation, and gold-plated contact finish. Verify that alternative components support the same staggered configuration if board space is constrained. Ensure the replacement part is compatible with the same pick-and-place packaging format to maintain assembly line efficiency.
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