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SLBL21-5R500G-10-33T is listed in the Balun range at ChipApex. The manufacturer field lists Shenzhen Sunlord Electronics Co., Ltd.. Its product description is MULTILAYER LTCC BALUN, 3000~8000. Review the specifications below when checking this part for your BOM.
The SLBL21-5R500G-10-33T is a multilayer LTCC balun manufactured by Shenzhen Sunlord Electronics. It operates within a frequency range of 3GHz to 8GHz, providing conversion between 50 Ohm and 100 Ohm impedances. The component features a maximum insertion loss of 1.5dB at 25°C and maintains a phase difference of 180° ±20°. Packaged in an 0805 (2012 Metric) surface-mount format with six PCB pads, it supports high-frequency RF applications requiring balanced signal processing.
Verify the complete part number including the suffix -33T to ensure correct packaging configuration. Confirm that the 0805 footprint matches the target PCB design. Check datasheet specifications for thermal management requirements during assembly. Ensure compatibility with standard reflow soldering profiles for LTCC components. Validate impedance matching networks for optimal performance at 5.5GHz center frequency.
Select this component when a compact solution is needed for balancing signals in the 3-8 GHz spectrum. Consider the 0805 package size for space-constrained designs. Evaluate the 1.5dB insertion loss against system power budget requirements. Verify that the 100 Ohm output impedance aligns with downstream circuit requirements. Assess thermal stability needs given the LTCC material properties.
This balun belongs to the SLBL series from Shenzhen Sunlord Electronics, designed specifically for RF applications. The LTCC technology allows for miniaturization while maintaining electrical performance. Similar parts in the series may offer different frequency ranges or impedance configurations. The 0805 package provides a balance between size and handling ease for automated assembly processes.
Direct substitutes must match the 3-8 GHz frequency range and 50/100 Ohm impedance ratio. Verify equivalent insertion loss and phase balance specifications. Ensure the replacement component uses compatible LTCC technology for similar thermal characteristics. Confirm identical 0805 footprint and pad configuration for board compatibility.
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