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SLV W 5 SMD 036 30 G is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is two rows 4-40 contacts Pack. Review the specifications below when checking this part for your BOM.
The SLV W 5 SMD 036 30 G is a surface-mount connector header manufactured by Fischer Elektronik. It features a two-row configuration with 30 contacts and a pitch spacing of 1.27 mm (0.050 inches). Designed for board-to-board or wire-to-board applications, this component supports standard surface-mount assembly processes, including soldering temperatures up to 260°C for 10 seconds. The series offers flexibility with contact counts ranging from 4 to 40 positions.
Verify the specific part number against official Fischer Elektronik documentation to ensure compatibility with your design requirements. Confirm that the surface-mount package and pin count match your PCB layout specifications. Check for any environmental ratings or RoHS compliance status directly from the manufacturer's datasheet before finalizing procurement decisions.
Select this component when a low-profile, surface-mount male header is required for 1.27 mm pitch applications. Ensure the target assembly can accommodate the two-row configuration and verify that the contact count aligns with the available options within the SLV W 5 SMD 036 series range.
This component belongs to the SLV W 5 SMD 036 series of male headers from Fischer Elektronik. The series provides various contact configurations, typically ranging from 4 to 40 positions, allowing designers to choose the appropriate density for their specific board-to-board or wire-to-board connection needs.
Compatible substitutes include other models within the SLV W 5 SMD 036 series, such as the SLV W 5 SMD 036 36 G ECO or SLV W 5 SMD 036 44 G, provided the contact count and mechanical dimensions are compatible with the existing design.
Explore related parts through Rectangular Connectors, Connectors, Interconnects, all product categories, ChipApex homepage.
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