SM662GXD BESS

Memory IC Overview

The SM662GXD-BESS is a NAND Flash memory component manufactured by Silicon Motion, Inc., belonging to the Ferri-eMMC series. It features a 100-LBGA package with dimensions of 14x18 mm. The device supports eMMC 5.0 interface standards and offers a storage capacity of 320 Gbit. It operates within a temperature range of -25°C to +85°C and complies with RoHS3 regulations.

Memory IC Feature Summary

• Supports eMMC 5.0 interface for embedded multimedia card applications
• Utilizes 100-LBGA surface mount packaging for compact integration
• Designed for robust embedded storage in demanding environments

Memory IC Applications

• Mobile devices
• Industrial automation systems
• Automotive infotainment
• IoT devices

Memory IC Procurement Notes

Verify the specific suffix BESS against official Silicon Motion documentation to confirm exact pinout, thermal characteristics, and compliance status. Ensure compatibility with host controller interfaces supporting eMMC 5.0 standards before integration into final designs.

Memory IC Selection Notes

Select this model when high-density embedded storage is required for mobile or industrial applications. Consider the 100-LBGA form factor for space-constrained PCB layouts. Verify operating temperature requirements align with the specified -25°C to +85°C range for environmental suitability.

Memory IC Part Context

This component is part of Silicon Motion's Ferri-eMMC portfolio, targeting embedded markets. It integrates NAND flash technology with controller capabilities in a standardized package, facilitating easier design-in for manufacturers of consumer electronics and industrial equipment requiring reliable non-volatile storage solutions.

Memory IC Replacement Considerations

Consult official substitution lists for compatible alternatives. Verify electrical and mechanical compatibility if considering cross-references from other manufacturers.