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SN74GTLP1395PWR is listed in the Translators, Level Shifters range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC TRANSLATOR BIDIR 20TSSOP. Review the specifications below when checking this part for your BOM.
The SN74GTLP1395PWR is a mixed-signal voltage level translator from the Texas Instruments SN74GTLP1395 series. It features two bidirectional circuits, each with one channel, designed to interface between LVTTL and GTLP logic families. The device operates within a supply voltage range of 3.15 V to 3.45 V and supports surface mount installation in a 20-TSSOP package. It functions reliably across an operating temperature range of -40°C to +85°C.
Verify the specific package variant against design requirements, as the SN74GTLP1395 family includes multiple options such as TSSOP and SOIC. Confirm that the 20-TSSOP form factor matches the target footprint. Ensure the component meets RoHS3 compliance standards if required by the manufacturing specification. Cross-reference the datasheet for exact pinout definitions before finalizing procurement orders.
Select this component when interfacing LVTTL sources with GTLP loads in bidirectional configurations. The dual-channel architecture allows for compact designs compared to using separate unidirectional translators. Verify that the 3.15 V to 3.45 V supply voltage range aligns with the system power rails. Consider the -40°C to +85°C industrial temperature rating for environmental suitability.
This part belongs to the SN74GTLP1395 family of Gunning-transceiver-logic-plus devices developed by Texas Instruments. The family targets applications in telecommunication and data communication backplanes where high-speed signaling and voltage compatibility are critical. The PWR suffix specifically denotes the 20-TSSOP surface-mount package option within this product line.
The SN74GTLP1395DWR serves as a functional alternative within the same family, offering identical electrical characteristics but housed in a 20-SOIC package. Designers must verify mechanical footprint compatibility when substituting between TSSOP and SOIC variants.
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