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SN74GTLPH306PWR is listed in the Translators, Level Shifters range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC TRANSLATOR BIDIR 24TSSOP. Review the specifications below when checking this part for your BOM.
The SN74GTLPH306PWR is a dual 1:2 GTL+ bus splitter manufactured by Texas Instruments. It features two independent buffers with separate output enable inputs, designed to split a single GTL+ signal into two paths while maintaining signal integrity. The device operates at a supply voltage of 3.3 V and supports data rates up to 800 Mbps. It utilizes a TSSOP-14 package, providing a compact solution for high-speed digital applications requiring GTL+ termination compatibility.
Verify the specific suffix 'PWR' corresponds to the TSSOP-14 package and tape-and-reel packaging configuration as per the manufacturer's official documentation. Confirm that the operating temperature range meets your system requirements before procurement. Ensure compatibility with existing GTL+ termination schemes in your design.
Select this component when a dual-channel GTL+ buffer is required for splitting signals in high-speed digital circuits. Consider the TSSOP-14 package size constraints and the need for independent output enable controls. Verify that the 3.3 V supply voltage aligns with your system's power architecture and that the 800 Mbps speed capability suffices for your data rate needs.
This part belongs to the SN74GTL family of logic devices, specifically optimized for GTL+ (Gunning Transceiver Logic Plus) applications. It serves as a critical interface component in systems transitioning from older logic families to high-speed, low-voltage standards. The device complements other GTL drivers and receivers within the same ecosystem.
Check for direct pin-compatible alternatives within the SN74GTL series that offer similar buffering capabilities. Verify if updated revisions or enhanced performance variants are available from Texas Instruments. Ensure any substitute maintains GTL+ compatibility and the same package footprint.
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