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SN74HCS367QDRQ1 is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUFFER NON-INVERT 6V 16SOIC. Review the specifications below when checking this part for your BOM.
The SN74HCS367QDRQ1 is an automotive-grade hex buffer and line driver from Texas Instruments, belonging to the HCS logic series. It features six non-inverting inputs and outputs housed in a 16-pin SOIC package. The device operates within a supply voltage range of 2 V to 6 V. Key electrical specifications include a maximum high-level output current of -7.8 mA and a low-level output current of 7.8 mA. Static current is limited to 100 nA, with a typical operating supply current of 2 µA. It supports surface-mount installation and functions reliably across an extended temperature range from -40°C to +125°C.
Verify the specific ordering suffix to confirm the package type and tape-and-reel configuration matches your assembly requirements. Ensure the component meets AEC-Q100 grade specifications for your target automotive application. Cross-reference the manufacturer datasheet for detailed mechanical dimensions and thermal characteristics before finalizing procurement decisions.
Select this component when designing circuits that require six buffered channels with Schmitt-trigger input characteristics. It is suitable for applications demanding operation at supply voltages between 2 V and 6 V. Consider the SOIC-16 package constraints and the specified current drive capabilities when evaluating compatibility with downstream loads.
This part belongs to the SN74HCS367 family of hex buffers and line drivers. It is specifically engineered for automotive electronics, offering enhanced reliability compared to standard commercial logic devices. The HCS series combines high-speed CMOS technology with Schmitt-trigger inputs to ensure stable operation in electrically noisy automotive environments.
The SN74HCS367QPWRQ1 serves as a direct functional substitute, offering identical logical operations but utilizing a TSSOP-16 package instead of the SOIC-16 form factor. Verify pinout compatibility and physical footprint differences before implementing any cross-package replacements in existing designs.
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