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SN74LV14APWT is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC INVERTER 6CH 1-INP 14TSSOP. Review the specifications below when checking this part for your BOM.
The SN74LV14APWT is a hex Schmitt-trigger inverter from the Texas Instruments SN74LV14A series. It operates on a single supply voltage ranging from 2 V to 5.5 V and features six independent inverting channels. The device utilizes CMOS logic technology and is housed in a 14-pin SOIC surface-mount package. It supports output drive currents of 12 mA for both high and low states, with a typical propagation delay of 14 ns. The component is rated for an operating temperature range from -55 °C to +125 °C.
Verify the specific suffix 'W' confirms the SOIC-14 package variant when sourcing. Confirm RoHS compliance status as required by project specifications. Ensure the ordering quantity aligns with the manufacturer's standard reel or cut-tape packaging options. Validate that the supply voltage requirements match the 2 V to 5.5 V operational range defined in the datasheet.
Select this component when six inverted outputs with Schmitt-trigger inputs are required. The LV14A series offers a balance of speed and power consumption suitable for general-purpose logic applications. Consider the 14-pin SOIC footprint for PCB layout compatibility. Verify that the 12 mA drive current meets the load requirements of the connected downstream components.
This part belongs to the SN74LV14A family of hex Schmitt-trigger inverters. It shares functional similarities with other logic families but is optimized for lower voltage operations compared to older standards. The device serves as a fundamental building block for digital signal processing and timing control applications requiring clean signal transitions.
SN74LV14APWR is a pin-compatible alternative with identical electrical characteristics but packaged in TSSOP-14 instead of SOIC-14. Other variants such as SN74LV14APWRE4 exist with minor manufacturing updates. Verify package dimensions carefully when substituting between SOIC and TSSOP footprints.
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