SN74LV32ARGYR

Inverter Gates Overview

The SN74LV32ARGYR is a quadruple 2-input positive-OR gate from the LV logic series, manufactured by Texas Instruments. It operates within a supply voltage range of 2 V to 5.5 V and features a propagation delay of 6.5 ns. The device provides low-level output current of 12 mA and high-level output current of -12 mA. Packaged in a 14-VQFN (3.5x3.5 mm) format, it supports mixed-mode voltage operation on all ports.

Inverter Gates Feature Summary

• Supports mixed-mode voltage operation across all ports
• Designed for 2-V to 5.5-V VCC operation
• Quadruple 2-input positive-OR logic function

Inverter Gates Applications

• Mixed-mode voltage interface circuits
• General-purpose digital logic applications
• Signal routing and selection systems

Inverter Gates Procurement Notes

Verify the specific package marking and revision level against the official datasheet to ensure compatibility with design requirements. Confirm that the 14-VQFN footprint matches the PCB layout exactly. Check for any recent product change notices regarding material or manufacturing site updates before finalizing procurement orders.

Inverter Gates Selection Notes

Select this component when a quad OR gate is required in a compact surface-mount package. Ensure the system voltage remains within the 2 V to 5.5 V operational range. Consider the 6.5 ns propagation delay for timing constraints. Verify thermal dissipation capabilities for the VQFN package under expected load conditions.

Inverter Gates Part Context

This part belongs to the SN74LV32A family of quadruple 2-input positive-OR gates. It shares functional characteristics with other variants like SN74LV32ATPWREP but differs in packaging. The LV series is optimized for low-voltage CMOS applications requiring high speed and wide operating voltage ranges.

Inverter Gates Replacement Considerations

SN74LV32ATPWREP offers identical logical functionality in a TSSOP-14 package. SN74LV32ARGYRG4Q1 is an automotive-grade variant with similar specifications. Verify pinout compatibility and thermal performance when substituting packages.