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SN74LVC1G240YZPR is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUF INVERT 5.5V 5DSBGA/5WCSP. Review the specifications below when checking this part for your BOM.
The SN74LVC1G240YZPR is a single-buffer and line driver from the Texas Instruments LVC logic series. It features one input and one output with inverting polarity, housed in a DSBGA-5 package. The device operates within a supply voltage range of 1.65 V to 5.5 V. It provides high drive capability with a low-level output current of 32 mA and a high-level output current of -32 mA. Static current consumption is limited to 10 µA. The component supports operation across an extended temperature range from -40 °C to +125 °C.
Verify the specific ordering suffix YZPR corresponds to the required DSBGA-5 package and tape-and-reel quantity configuration. Confirm that the LVC logic family specifications align with the target system's voltage and speed requirements. Ensure compliance with RoHS directives and check for any recent product change notices affecting pinout or electrical characteristics before finalizing procurement.
Select this component when a compact, single-channel inverting buffer is needed for high-speed digital signals. The LVC series offers a balance of low power consumption and robust drive strength suitable for mobile and battery-operated equipment. Consider the DSBGA-5 footprint constraints and the requirement for inverting logic behavior during schematic design.
This part belongs to the SN74LVC1G240 family of single-buffer/line drivers. It shares core electrical characteristics with other variants in the series but differs primarily in packaging options such as SON or SC70. The YZPR suffix specifically denotes the DSBGA-5 surface-mount package, distinguishing it from through-hole or larger footprint alternatives within the same logical function set.
Direct substitutes include SN74LVC1G240DSFR (SON-6 package) and SN74LVC1G240DBVR (SOT-353 package). Verify pin compatibility and thermal performance when transitioning between these package types.
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