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SN74LVC1G34DBVTE4 is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUF NON-INVERT 5.5V SOT23-5. Review the specifications below when checking this part for your BOM.
The SN74LVC1G34DBVTE4 is a single non-inverting buffer manufactured by Texas Instruments, belonging to the LVC logic series. It operates within a supply voltage range of 1.65 V to 5.5 V and features a push-pull output capable of sourcing and sinking 32 mA. The device is housed in a SOT-23-5 package with surface mount installation. Key electrical parameters include a propagation delay of 4.1 ns at 3.3 V and 3.2 ns at 5 V, with a maximum operating temperature of +125°C and a minimum of -40°C.
Verify the specific suffix 'E4' indicates RoHS compliance and lead-free status as per Texas Instruments documentation. Confirm the package marking and pinout match the SOT-23-5 specification. Ensure the order quantity aligns with the manufacturer's standard reel size or cut tape availability requirements for production integration.
Select this component when a single-channel non-inverting buffer is required for low-voltage applications. The LVC series offers improved performance over older standards while maintaining compatibility. Consider the SOT-23-5 footprint constraints and the need for high drive strength when evaluating alternative logic families for space-constrained designs.
This part is part of the SN74LVC1Gxx family of single-function logic gates. It shares the same physical package and basic operational characteristics as other members like the SN74LVC1G07, but differs in logical function and output structure. The device is designed for general-purpose digital signal processing in modern electronic systems requiring small form factors.
Direct substitutes include SN74LVC1G34DCKT and SN74LVC1G34DBVR. Verify pin compatibility and electrical specifications before substitution. Cross-reference with SN74LVC1G34DBVT for equivalent performance in similar packaging configurations.
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