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SN74LVC2G34DBVR-EV is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists EVVO. Its product description is IC BUF NON-INVERT 5.5V SOT23-6. Review the specifications below when checking this part for your BOM.
The SN74LVC2G34DBVR-EV is a dual non-inverting buffer manufactured by EVVO, utilizing advanced CMOS technology. It operates within a supply voltage range of 1.65V to 5.5V and features overvoltage tolerant inputs capable of accepting voltages up to 5.5V. The device provides balanced output sink and source capabilities of 24mA. It exhibits near-zero static supply current, reducing system power requirements. The component is RoHS compliant and Pb-free.
Verify the manufacturer designation as EVVO rather than Texas Instruments, despite the naming convention similarity. Confirm the package type corresponds to SOT-23-6 based on the ordering information provided in the datasheet. Ensure compliance with RoHS standards and lead-free status matches project requirements. Check specific delivery modes such as tape and reel availability if applicable.
Select this component when a dual-channel non-inverting buffer is required for signal integrity maintenance. The wide operating voltage range supports compatibility with various logic families. Consider the 24mA drive strength for driving moderate loads without external amplification. The compact SOT-23-6 package is suitable for space-constrained PCB layouts.
This part belongs to the SN74LVC series of logic buffers. It serves as a dual-channel version of single-channel buffers like the SN74LVC1G34. The device is designed for general-purpose digital signal buffering in low-voltage applications. It complements other LVC family components offering similar functionality with varying channel counts or packages.
Direct substitutes include SN74LVC2G34DCKR (SC70-6 package) and SN74LVC2G34DRYR (DFN6 package). These variants share identical electrical characteristics but differ in physical footprint. Verify pinout compatibility and thermal resistance differences when transitioning between package types.
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