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SN74LVTH573RGYR is listed in the Latches range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC D-TYPE TRANSP SGL 8:8 20VQFN. Review the specifications below when checking this part for your BOM.
The SN74LVTH573RGYR is an octal transparent D-type latch with 3-state outputs from the Texas Instruments LVTH series. It operates within a supply voltage range of 2.7 V to 3.6 V and features non-inverting logic. The device provides high drive capability with low-level output currents of 32 mA and high-level output currents of -32 mA. Propagation delay is specified at 2.9 ns at 3.3 V, with a maximum static current of 5 mA. It functions reliably across an operating temperature range of -40°C to +85°C and is housed in a 20-pin VQFN package.
Verify the specific suffix RGYR corresponds to the 20-pin VQFN package variant when sourcing. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure ESD handling protocols are followed during assembly due to CMOS sensitivity. Cross-reference pinout diagrams with target PCB layout requirements to prevent misalignment.
Select this component for applications requiring high-speed latching with strong output drive capabilities at 3.3 V logic levels. The LVTH series offers improved performance over standard LVT counterparts. Consider the VQFN package for space-constrained designs requiring surface-mount technology. Evaluate thermal dissipation needs given the 32 mA output drive specifications under load conditions.
This part belongs to the SN74LVTH573 family of octal latches manufactured by Texas Instruments. It utilizes Advanced BiCMOS Technology (ABT) to achieve high speed while maintaining low power consumption. The device serves as a key interface element between processors and peripheral devices in digital logic circuits.
SN74LVTH573PW is available in a TSSOP-20 package offering equivalent electrical characteristics. SN74LVTH573DW provides the same functionality in an SOIC-20 package. Verify pin compatibility and thermal performance before substituting these variants.
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