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TC7S32F,LF is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is IC GATE OR 1CH 2-INP SMV. Review the specifications below when checking this part for your BOM.
The TC7S32F,LF is a single-channel CMOS digital integrated circuit containing one 2-input OR gate. It operates within a supply voltage range of 2.0 V to 6.0 V and supports an operating temperature from -40°C to 85°C. The device features a maximum quiescent current of 1 µA at 25°C and typical propagation delays of 7 ns at 5 V with 15 pF load capacitance. Output drive capability supports up to five LSTTL loads with symmetrical output impedance.
Verify the specific package variant (SMV or USV) required for the design, as the base part number covers multiple physical packages. Confirm RoHS compliance status through official Toshiba documentation prior to integration. Ensure that the application does not fall under restricted categories such as aerospace or nuclear facilities, as these are explicitly excluded from liability coverage.
Select this component when a single 2-input OR function is needed in a compact surface-mount footprint. It is appropriate for designs requiring low static power consumption and operation across a broad voltage spectrum. Consider the SMV or USV package based on available board space and thermal requirements. Verify that the load capacitance and transition times meet the system timing constraints.
This component belongs to the TC7S series of high-speed CMOS logic gates manufactured by Toshiba Semiconductor and Storage. The series is designed to provide performance comparable to standard HC logic families while offering reduced power consumption. The TC7S32F specifically implements the OR logic function in a minimal pin-count package suitable for dense PCB layouts.
Direct substitutes include other single 2-input OR gates in similar small packages, such as the TC7S32FU. When replacing, ensure the alternative maintains compatible supply voltage ranges and propagation delay characteristics. Verify that the replacement package matches the existing footprint if reflow soldering is required without layout changes.
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