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TLP2108(TP,F) is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISO 2.5KV 2CH PUSH PULL 8-SO. Review the specifications below when checking this part for your BOM.
The TLP2108(TP,F) is a high-speed optocoupler featuring an inverting logic output with a totem-pole configuration. It integrates GaAlAs light-emitting diodes and high-gain, high-speed photodetectors. The device supports data rates up to 5 Mbps and offers an isolation voltage of 2500 Vrms. It operates within a power supply range of 4.5 V to 20 V and maintains performance across temperatures from -40°C to 100°C. Key electrical specifications include a maximum switching time of 250 ns and a common-mode transient immunity of ±10 kV/μs.
Verify the specific suffix (TP, F) to confirm tape-and-reel packaging and temperature grade requirements. Ensure the procurement documentation references the official Toshiba Semiconductor datasheet for accurate electrical parameters. Confirm RoHS compliance status through the manufacturer's current product change notifications or ordering information sheets before finalizing purchase orders.
Select this component when inverting logic output is required for digital isolation applications. The totem-pole output structure eliminates the need for external pull-up resistors, simplifying circuit design. Consider the 2500 Vrms isolation rating for safety-critical systems. Verify that the input threshold current and switching time specifications meet the timing constraints of the target communication interface.
This part belongs to Toshiba’s high-speed photocoupler family designed for robust digital isolation. It serves as a bridge between low-voltage control circuits and higher-voltage load sides. The integration of advanced photodetectors allows for reliable operation in noisy environments where standard optocouplers might fail due to slow response times or low immunity to voltage spikes.
Direct substitutes must match the 5 Mbps speed, inverting totem-pole output, and SOIC-8 package. Verify equivalent isolation voltage and common-mode transient immunity ratings. Cross-reference pinouts to ensure compatibility without PCB redesign.
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