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TLP521-1GRSM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLTR 5.3KV 1CH TRANS 4-SMD. Review the specifications below when checking this part for your BOM.
The TLP521-1GRSM is a single-channel phototransistor optocoupler manufactured by Isocom Components. It features an infrared LED coupled to an NPN phototransistor in a surface-mount package. Key electrical parameters include a maximum DC forward current of 50 mA, a collector-emitter saturation voltage of 400 mV, and an operating temperature range from -30°C to +100°C. The device provides high-density mounting capabilities with robust isolation characteristics suitable for compact circuit designs.
Verify the specific suffix GRSM against official Isocom Component datasheets to confirm surface-mount pinout and tape-and-reel specifications. Ensure compatibility with existing PCB footprints and reflow soldering profiles. Cross-reference part numbers with authorized distributors to validate authenticity and traceability before procurement.
Select this component when space-constrained designs require single-channel isolation with surface-mount convenience. Consider the 50 mA forward current limit and 400 mV saturation voltage for logic-level interfacing. Evaluate thermal management requirements within the specified -30°C to +100°C operating range for reliable long-term performance.
This device belongs to the TLP521 series of high-density phototransistor optically coupled isolators. The series offers various channel configurations and packaging options to meet diverse isolation needs. Isocom Components manufactures these devices to replace legacy parts while maintaining standard pinouts and electrical characteristics for seamless integration.
TLP521-1GB serves as a verified through-hole replacement option within the same product family. Verify that the DIP-4 footprint and lead spacing match the target application constraints when substituting surface-mount variants with through-hole equivalents.
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