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TLP523(F) is listed in the Isolators - Gate Drivers range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is PHOTOCOUPLER. Review the specifications below when checking this part for your BOM.
The TLP523(F) is a logic output optocoupler manufactured by Toshiba Semiconductor and Storage. It integrates a gallium arsenide infrared emitting diode with a silicon Darlington-connected phototransistor featuring an integral base-emitter resistor to optimize switching speed and elevated temperature characteristics. The device provides electrical isolation between input and output circuits. Key electrical parameters include a minimum current transfer ratio of 500% at an forward current of 1 mA, a collector-emitter voltage of 55 V minimum, and a maximum leakage current of 10 μA at 85°C. The unit offers a minimum isolation voltage of 2500 Vrms.
Verify component authenticity through official Toshiba Semiconductor and Storage channels or authorized distributors. Confirm the specific suffix (F) matches package requirements. Check for End-of-Life status as some variants in this series may be discontinued. Ensure compliance with RoHS directives if required by the application environment. Validate datasheet revisions for any parameter updates before final design integration.
Select this component when high current transfer ratios are required for efficient signal transmission. The integrated base-emitter resistor simplifies circuit design by reducing external component count. Consider the 55 V collector-emitter voltage rating for low-voltage DC switching applications. Verify that the 2500 Vrms isolation voltage meets safety standards for the target system. Evaluate thermal management needs given the operating temperature range and power dissipation limits.
The TLP523(F) belongs to the TLP523 family of optocouplers from Toshiba Semiconductor and Storage. This family includes single, dual, and quad channel variants such as TLP523, TLP523-2, and TLP523-4. These devices share similar internal architectures using GaAs LEDs and Darlington phototransistors. The F suffix typically denotes a specific packaging configuration, often a DIP format, distinguishing it from surface-mount alternatives like the TLP523(D4,E).
Public confirmed substitute part numbers were not identified in the provided source material. Cross-referencing with other manufacturers requires independent verification of pinout compatibility, electrical parameters, and isolation ratings. Consult Toshiba Semiconductor and Storage for official obsolescence notices or recommended replacement components.
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