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TLP627MF(D4-T4,E is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Toshiba Semiconductor and Storage. Its product description is OPTOISOLATOR 5KV 1CH DARL 4-SMD. Review the specifications below when checking this part for your BOM.
The TLP627MF(D4-T4,E is a quad-channel photodarlington optocoupler from Toshiba Semiconductor and Storage. It integrates four infrared emitting diodes with four phototransistors in a single package. The device features an integral base-emitter resistor on each phototransistor to optimize switching speed and high-temperature performance. Key electrical parameters include a minimum collector-emitter voltage of 300 V, a minimum current transfer ratio of 1000%, and a minimum isolation voltage of 5000 Vrms. It operates within a temperature range of -55°C to +100°C.
Verify the specific suffix (D4-T4,E) against official Toshiba documentation to confirm surface-mount packaging and tape-and-reel delivery format. Ensure compliance with RoHS directives and check for any regional supply restrictions or lifecycle status updates prior to finalizing procurement plans.
Select this component when multiple isolated DC signal paths are required in a space-constrained application. The integrated base-emitter resistors simplify driver circuit design by reducing external component count. Verify that the 300 V collector-emitter rating meets the load requirements and that the 5000 Vrms isolation level satisfies safety standards.
This part belongs to the TLP627 series, which includes variants with one, two, and four channels. While other versions use through-hole DIP packages, this specific model utilizes a surface-mount configuration. The series is characterized by high current transfer ratios and robust isolation, making it a standard choice for industrial signal isolation tasks.
Direct pin-compatible replacements within the same family include TLP627M(TP1,E and TLP627M(E. Verify that substitute parts maintain the required quad-channel configuration and surface-mount footprint before implementation.
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