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TMS320DM6467ZUTA is listed in the Digital Signal Processor Dsp range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC DIGITAL MEDIA SOC 529-FCBGA. Review the specifications below when checking this part for your BOM.
The TMS320DM6467ZUTA is a Digital Media System-on-Chip (DMSoC) from Texas Instruments, part of the DaVinci family. It integrates a C64x+ DSP core operating at 594 MHz and an ARM926EJ-S core at 297 MHz. The device features 248 KB of on-chip RAM and 8 KB of ROM. It utilizes a 529-pin FCBGA package with a 19x19 mm footprint. Key peripherals include a 10/100/1000 Mb/s Ethernet MAC, USB 2.0 PHY, PCI interface, and dual HDVICP engines for video processing. The component operates with 1.2 V core voltage and 1.8 V/3.3 V I/O voltages.
Verify component status as this specific ZUTA suffix variant is classified as End of Life (EOL). Confirm that the required package type aligns with current production orderables, which typically utilize the CUT suffix for Pb-Free BGA packages. Ensure design compatibility with available replacement silicon revisions before finalizing procurement plans.
Select this model when a fixed-point DSP solution with integrated ARM control is required for multimedia applications. The 594-MHz clock speed defines the maximum computational throughput for the C64x+ core. Verify thermal management requirements based on the 529-pin FCBGA package characteristics and ensure the PCB layout supports the necessary power distribution for 1.2 V and 1.8 V/3.3 V domains.
This component belongs to the TMS320DM646x series within the DaVinci technology portfolio. It is designed to replace or complement earlier generations by offering enhanced video processing capabilities through dedicated hardware accelerators. The ZUTA designation specifically identifies the 529-pin FCBGA package configuration used in this iteration of the DMSoC.
Public documentation indicates that ZUT/ZUTA orderables are replaced by CUT suffix variants (e.g., TMS320DM6467CCUT) which feature Pb-free die bumps and solder balls. These replacements maintain functional equivalence while adhering to updated environmental compliance standards.
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