TOLC-130-32-L-Q-A

Headers, Male Pins Overview

The TOLC-130-32-L-Q-A is a FOURRAY™ Quad Row SMT terminal strip manufactured by Samtec Inc. It features a 120-position configuration across four rows with a 0.050-inch (1.27mm) mating pitch. The connector utilizes phosphor bronze contacts with selective gold plating (10.0µin/0.25µm on mating surfaces). Designed for board-to-board applications, it offers a stacking height of 12mm and supports a rated current of 2.4A per contact. The housing is constructed from black liquid crystal polymer (LCP) with UL94 V-0 flammability ratings, operating within a temperature range of -55°C to +125°C.

Headers, Male Pins Feature Summary

• Quad row interconnect architecture enabling high I/O density in compact footprints
• Selective gold plating on contact areas for reliable signal transmission
• Surface mount termination compatible with automated pick-and-place assembly

Headers, Male Pins Applications

• High-density board-to-board connections
• Mezzanine circuit interconnects
• Space-constrained electronic assemblies requiring robust mechanical retention

Headers, Male Pins Procurement Notes

Verify the specific suffix 'K' or 'TR' if reel or tube packaging is required, as the base part number may default to tube packaging. Confirm that the 12mm stacking height aligns with system mechanical constraints. Ensure compatibility with corresponding SOLC receptacles for proper mating interface. Check RoHS compliance status against current regulatory requirements before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a 12mm vertical separation between PCBs is necessary. The 120-position count suits designs requiring substantial parallel data paths. Verify that the 0.050-inch pitch matches the target footprint. Consider the LQ-A variant's alignment pin feature if precise positioning during assembly is critical for the production line.

Headers, Male Pins Part Context

This part belongs to the Samtec TOLC series, designed for high-performance mezzanine applications. It pairs with SOLC receptacles to form complete interconnect solutions. The series emphasizes space efficiency, allowing up to 200 I/Os in minimal area. The TOLC-130-32-L-Q-A specifically addresses needs for taller stack-ups while maintaining standard 0.050-inch spacing for broad compatibility.

Headers, Male Pins Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Direct replacement requires matching the exact stacking height, position count, and mounting style. Alternative series such as FOLC or MOLC offer different contact geometries and should be evaluated only if mechanical interfaces can be adapted.