TS25P07G-K C2G

Bridge Rectifier Overview

The TS25P07G-K C2G is a single-phase bridge rectifier manufactured by Taiwan Semiconductor. It features a glass-passivated junction and utilizes the TS-6P through-hole package. The device supports an average forward current of 25 A with a repetitive peak reverse voltage of 1000 V. Key electrical parameters include a maximum surge peak forward current of 350 A, a typical forward voltage of 1.1 V at 12.5 A, and a junction temperature range from -55°C to +150°C. The component complies with RoHS directives and carries UL recognition.

Bridge Rectifier Feature Summary

• Glass passivated junction for enhanced reliability
• High surge current capability for robust operation
• Suitable for printed circuit board mounting

Bridge Rectifier Applications

• Switching mode power supplies (SMPS)
• Adapters
• TV sets
• Monitors

Bridge Rectifier Procurement Notes

Verify the specific ordering code against the manufacturer's official documentation to ensure correct package and packing configuration. Confirm that the suffix designations align with the required halogen-free status and tube packaging specifications before finalizing procurement orders.

Bridge Rectifier Selection Notes

Select this component for applications requiring a 25 A rating and 1000 V reverse voltage tolerance in a through-hole format. Ensure thermal management accounts for the junction-to-case thermal resistance when designing heat sink solutions for continuous high-current operations.

Bridge Rectifier Part Context

This part belongs to the TS25P series of glass-passivated bridge rectifiers from Taiwan Semiconductor. The series includes variants with different reverse voltage ratings, such as 600 V and 800 V options, all sharing similar mechanical dimensions and current handling capabilities within the TS-6P package.

Bridge Rectifier Replacement Considerations

Direct substitutes within the same series include TS25P05G-K and TS25P06G-K, which offer lower reverse voltage ratings of 600 V and 800 V respectively while maintaining identical current and package specifications.