Diode Arrays UGF1005G product image

UGF1005G

$1.16
  • Description:DIODE ARRAY GP 300V 10A ITO220AB
  • Series:-

SKU:fe540366abec Category: Brand:

  
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UGF1005G is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Taiwan Semiconductor Corporation. Its product description is DIODE ARRAY GP 300V 10A ITO220AB. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for UGF1005G

  • Description:DIODE ARRAY GP 300V 10A ITO220AB
  • Series:-
  • Mfr:Taiwan Semiconductor Corporation
  • Package:Tube
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):300 V
  • Current - Average Rectified (Io) (per Diode):10A
  • Voltage - Forward (Vf) (Max) @ If:1.25 V @ 5 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):20 ns
  • Current - Reverse Leakage @ Vr:10 µA @ 300 V
  • Operating Temperature - Junction:-55°C ~ 175°C
  • Mounting Type:Through Hole
  • Package / Case:TO-220-3 Full Pack, Isolated Tab
  • Supplier Device Package:ITO-220AB
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for UGF1005G

UGF1005G

Diode Arrays Overview

The UGF1005G is a dual common cathode ultra-fast recovery rectifier manufactured by Taiwan Semiconductor Corporation. It features a 300 V repetitive peak reverse voltage and supports a continuous average forward current of 5 A per diode. The device utilizes an ITO-220AB insulated package for through-hole mounting, providing electrical isolation between the terminals and the heatsink. Key electrical characteristics include a maximum non-repetitive peak forward surge current of 100 A and a low reverse leakage current of 10 µA at rated voltage. The junction temperature range spans from -55°C to 175°C, ensuring reliable operation in demanding thermal environments.

Diode Arrays Feature Summary

  • Ultra-fast recovery performance with minimal reverse recovery time for high-frequency switching applications
  • Electrically isolated ITO-220AB package design enabling direct heatsink mounting without additional insulators
  • High thermal stability supporting extended junction temperature ranges up to 175°C

Diode Arrays Applications

  • High-frequency DC-DC converters requiring fast switching speeds
  • Free-wheeling rectification in power supply circuits
  • Isolated power modules needing integrated thermal management

Diode Arrays Procurement Notes

Verify the specific suffix codes against official datasheets to confirm package variations and marking details. Ensure that procurement specifications align with the required insulation class and thermal resistance values. Cross-reference manufacturer part numbers with distributor listings to confirm authenticity and traceability. Check for any recent product change notices regarding packaging or sourcing updates before finalizing orders.

Diode Arrays Selection Notes

Select this component when circuit designs demand both high-speed rectification and efficient thermal dissipation through an insulated mount. The 300 V rating suits low-voltage high-current applications where standard packages might require separate insulating hardware. Consider the 5 A per diode capability relative to total load requirements and derating factors. Verify compatibility with existing PCB footprints and heatsinking strategies due to the specific ITO-220AB form factor.

Diode Arrays Part Context

This device belongs to the UGF series of ultra-fast recovery rectifiers from Taiwan Semiconductor. It shares architectural similarities with other members like the UGF1008G but differs in voltage ratings and current capacities. The series is designed for modern power electronics that prioritize efficiency and compact thermal solutions. It complements the broader portfolio of discrete diodes offered by the manufacturer for industrial and consumer power applications.

Diode Arrays Replacement Considerations

Direct substitutes may include other 300 V, 5 A dual common cathode ultra-fast rectifiers in insulated TO-220 variants. Verify pinout compatibility and thermal resistance specifications before substitution. Alternative parts must match or exceed the original reverse recovery time and junction temperature limits to maintain circuit performance.

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