Memory IC W632GG8KB-11 TR product image

W632GG8KB-11 TR

  • Description:IC DRAM 2GBIT PAR 78WBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)

SKU:a2795257ddfa Category: Brand:

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W632GG8KB-11 TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 2GBIT PAR 78WBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W632GG8KB-11 TR

  • Description:IC DRAM 2GBIT PAR 78WBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3
  • Memory Size:2Gbit
  • Memory Organization:256M x 8
  • Memory Interface:Parallel
  • Clock Frequency:933 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.425V ~ 1.575V
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:78-TFBGA
  • Supplier Device Package:78-WBGA (10.5x8)
  • Access Time:20 ns

Memory IC datasheet and documents for W632GG8KB-11 TR

W632GG8KB-11 TR

Memory IC Overview

The W632GG8KB-11 TR is a 2 Gbit DDR3 SDRAM organized as 32M x 8 with eight internal banks. It supports a maximum operating frequency of 933 MHz (DDR3-1866) and operates at a standard voltage of 1.5V ± 0.075V. The device utilizes a 78-ball WBGA package measuring 8x10.5 mm². It features an SSTL_15 interface, differential clock inputs, and source-synchronous data strobes.

Memory IC Feature Summary

  • Supports high-speed data transfers up to 1866 Mb/sec/pin using double data rate architecture.
  • Includes programmable on-die termination for improved signal integrity during writes.
  • Features a Multi Purpose Register for system timing calibration via write leveling.
  • Provides asynchronous reset functionality for power-up initialization sequences.

Memory IC Applications

  • High-performance computing systems requiring fast memory access
  • Graphics processing units and display controllers
  • Network infrastructure equipment

Memory IC Procurement Notes

Verify the specific speed grade suffix matches the required frequency bin. Confirm the 'TR' designation indicates tape and reel packaging. Ensure the component meets RoHS compliance standards for lead-free materials. Check for industrial temperature range requirements if operating below 0°C.

Memory IC Selection Notes

Select this part for applications needing 2 Gbit capacity in a compact 78-ball package. Choose based on the -11 speed grade for 1866 MT/s operation. Consider the -12I or -15I variants if extended temperature ranges are necessary. Verify compatibility with the host controller's supported CAS latencies and burst lengths.

Memory IC Part Context

This component belongs to the Winbond W632GG8KB series of DDR3 SDRAMs. It is designed for general-purpose high-speed memory applications. The series offers various speed grades to accommodate different system performance requirements while maintaining a consistent pinout and electrical interface.

Memory IC Replacement Considerations

Compatible substitutes include other 2 Gbit DDR3 SDRAMs from manufacturers like Micron or Samsung with matching 78-ball packages. Ensure the replacement supports the same 1.5V supply voltage and SSTL_15 signaling levels. Verify that the substitute part supports the required 933 MHz frequency and similar timing parameters.

W632GG8KB-11 TRW632GG8KB-11 TR

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