W97AH6NBVA2I

Memory IC Overview

The W97AH6NBVA2I TR is a 1 Gbit LPDDR2-S4B dynamic random access memory manufactured by Winbond Electronics. It features a 16-bit data bus width and operates at a maximum clock frequency of 400 MHz. The device is organized as 64 Meg x 16 bits and utilizes a VFBGA-134 package for surface mount installation. It supports an operating temperature range from -40°C to +85°C. Power supply requirements include a minimum voltage of 1.14 V and a maximum of 1.95 V, with a maximum power current of 30 mA.

Memory IC Feature Summary

• Supports LPDDR2-S4B interface protocol for mobile applications
• Includes ZQ calibration command for output driver impedance adjustment
• Features partial array self-refresh capability via bank or segment masking
• Integrates on-die temperature sensor for thermal monitoring

Memory IC Applications

• Mobile computing devices requiring low-power SDRAM
• Portable consumer electronics utilizing LPDDR2 interfaces
• Embedded systems operating within industrial temperature ranges

Memory IC Procurement Notes

Verify the component status directly with the manufacturer before procurement. Confirm that the specific ordering suffix matches the required package and temperature specifications. Ensure compliance with RoHS3 standards and check for any recent product change notifications affecting material composition or packaging.

Memory IC Selection Notes

Select this component when a 1 Gbit capacity with a 16-bit bus width is required for mobile designs. Ensure the system supports the HSUL_12 I/O standard and provides the necessary voltage rails between 1.14 V and 1.95 V. Verify that the PCB layout accommodates the VFBGA-134 footprint and meets the humidity sensitivity level 3 requirements during assembly.

Memory IC Part Context

This part belongs to the W97AHxNB series of LPDDR2-S4B memories. It shares functional similarities with other capacities in the family but differs in organization and pinout configurations. The datasheet revision A01-002 details the electrical characteristics and timing parameters specific to this generation of mobile DRAM components.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Consult the manufacturer for potential obsolescence notices or alternative recommendations if this specific variant is discontinued.