SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The WG92SAD9SY-D54-4 is a rectangular MIL-Spec connector from the AirBorn W Series, manufactured by Molex. It functions as a board mount receptacle with 92 positions arranged in three rows. The component utilizes through-hole termination for socket contacts and features a straight installation angle. Constructed with a Polyphenylene Sulfide (PPS) shell and copper alloy contacts plated with gold, it supports a 2.54 mm pitch. Rated for 1 kV voltage and 5 A current, it operates within a temperature range of -65°C to +125°C.
Verify the specific suffix D54-4 against official datasheets to confirm polarization and guide set configurations. Ensure compatibility with mating plugs in the W Series. Confirm RoHS compliance status directly with the manufacturer or authorized distributors before integration into regulated assemblies.
Select this part for applications demanding high pin counts in a compact footprint. The three-row configuration maximizes density while maintaining standard 2.54 mm spacing. Verify that the straight through-hole mounting style aligns with the PCB layout constraints and mechanical clearance requirements of the enclosure design.
This component belongs to the AirBorn W Series, a line of rectangular connectors designed for harsh environments. The series offers various row counts and termination styles. This specific model represents a high-density receptacle option within the family, providing robust connectivity solutions for critical infrastructure and aerospace applications.
Cross-reference with M55302/58-B92X equivalents. Verify dimensional tolerances and contact alignment before substitution. Ensure mating interface compatibility with existing system components to prevent mechanical interference.
NXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More
Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
In the embedded world, general-purpose CPUs are great at running operating systems, and MCUs excel at logic control. But when you need to process…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More