XCZU49DR-L1FSVF1760I

Soc System On Chip Overview

The XCZU49DR-L1FSVF1760I is an industrial-grade Zynq UltraScale+ RFSoC from AMD, integrating a programmable logic fabric with a quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5F processor subsystem. It features approximately 930K logic elements and 53,160 Adaptive Logic Modules within a 1760-ball FCBGA package. The device supports maximum clock frequencies of 533 MHz for the A53 cores and 1.3 GHz for the R5F cores. Key specifications include 38 Mbit of embedded memory and support for high-speed peripherals such as PCIe Gen3.

Soc System On Chip Feature Summary

• Integrated RF Transceivers: Includes 16-channel 2.5 GSPS RF-ADC and 16-channel 9.85 GSPS RF-DAC for direct RF sampling up to 6 GHz.
• High-Performance Processing: Combines a quad-core ARM Cortex-A53 MPCore and dual-core ARM Cortex-R5F MPCore with CoreSight debug infrastructure.
• Large FPGA Fabric: Provides 930K+ logic cells and 53,160 LABs for complex digital signal processing and control tasks.
• Industrial Reliability: Rated for operating temperatures between -40°C and +100°C (TJ) for demanding environments.

Soc System On Chip Applications

• Phased Array Radar Systems
• Electronic Warfare and Reconnaissance
• Satellite Communication Terminals
• 5G Millimeter-Wave Base Stations

Soc System On Chip Procurement Notes

Verify availability status directly with AMD or authorized distributors, as lead times may vary significantly due to supply chain constraints. Confirm that the specific suffix 'L1' corresponds to the intended industrial temperature grade and package variant before ordering. Ensure compliance with RoHS3 standards and check for any pending Product Change Notices affecting this part number.

Soc System On Chip Selection Notes

Select this model when high-density RF data conversion is required alongside substantial programmable logic resources. Compare against the XCZU49DR-2FFVF1760I if higher performance grades are needed, noting potential differences in speed bins and pricing. Ensure the design accommodates the thermal requirements of the 1760 BGA package and utilizes appropriate DDR memory interfaces for system stability.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ RFSoC family, designed specifically for applications requiring tight integration of RF front-end capabilities with software-defined radio processing. It serves as a successor to earlier MPSoC generations by embedding high-speed ADCs and DACs directly into the silicon die, reducing board complexity and signal integrity issues associated with external converters.

Soc System On Chip Replacement Considerations

No direct pin-to-pin replacements exist within the same package due to the unique integration of RF transceivers. Alternative solutions require redesigning the PCB layout and firmware architecture. Consider the XCZU49DR-2FFVF1760I for higher performance needs or the XCZU49DR-1FSVF1760EES9919 for commercial grade variants, though these involve different electrical characteristics and temperature ranges.