SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Specialized Backplane Connectors conform to a set of specifications for use with daughterboards, midplane, coplanar, or front boards, and are meant to be used in a backplane or rack and panel system. They are characterized by the connector type, number of positions, pitch, number of rows, and contact layout.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® |
740611124View Product
1643076-1View Product
10114868-Q0J-40DLFView Product
10113947-J0C-80DLFView Product
923-4P0E-40HView Product
89006-1118LFView Product
10121401-101LFView Product
761505120View Product
VSM-05-40-080-50-03-NView Product
2-292246-2View Product
516-056-501-410View Product
8511459-220 REV CView Product
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More