Unclassified

Select products	Mfr	Description	Package	Series
1302263843 $21.17	Molex	RETAINING RING; EXT. FOR 0.669IN	Bulk	*
1302264173 $237.77	Molex	CABLE ASSEMBLIES	Bulk	*
1302264178 $239.67	Molex	SPACER	Bulk	*
1302264295 $402.87	Molex	CABLE ASSEMBLIES	Bulk	*
1302264344 $2,157.62	Molex	CABLE ASSEMBLIES	Bulk	*
1302264391 $103.60	Molex	HOSE STOP 1.25 IN	Bulk	*
1302264544 $275.77	Molex	WHEEL	Bulk	*
1302264655 $16.41	Molex	CABLE; #10/7C SO 600V 90C	Bulk	*

Oct 2, 2025

OpenAI Reaches Preliminary Agreement with Samsung and SK Hynix to Supply Chips for the “Stargate” Project

On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…

Red rocker switch beside laboratory equipment with a panel-mounted switch

Oct 27, 2026

Rocker switch selection: ratings, illumination and panel fit

Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.

Mar 2, 2026

Vishay Announces 8%-12% Price Hike for MOSFETs and ICs Amid Rising Raw Material Costs

Vishay Intertechnology, Inc., a global leader in discrete semiconductors and passive electronic components, has officially announced a price adjustment for its Metal-Oxide-Semiconductor Field-Effect Transistors…

Aug 6, 2026

Renesas Electronics to Phase Out Takasaki Factory Manufacturing in 2–3 Years (R&D Preserved)

TOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…

Allegro MicroSystems Announces 10%+ Global Price Hike | April 2026 Update

Mar 27, 2026

Allegro MicroSystems Announces Global Price Adjustments for All Product Lines Effective April 27, 2026

Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…

Small logic packages based on ChipApex imagery beside a generic digital controller and analyzer

Oct 28, 2026

Logic inverter IC guide: truth tables and voltage levels

Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.

IMU product image against an illustrative robot application scene

Oct 23, 2026

What Is an IMU? Sensors, Axes and Applications

Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.

Infineon Raises Prices in 2026 Amid AI-Driven Power Semiconductor Surge

Feb 9, 2026

Infineon Announces Price Increase: Power Device Prices to Rise Effective April 1, Driven by Surging AI Demand and Mounting Cost Pressures

Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…

Four-position piano DIP switch based on ChipApex category imagery beside a controller enclosure

Oct 28, 2026

DIP switch guide: types, positions and PCB configuration

Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.

ChipApex gyroscope package over an illustrative industrial robotics background

Oct 22, 2026

How Does a Gyroscope Work? MEMS Principles and Selection

See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.

May 30, 2025

The Trends of Modularization for Embedded Integrated Circuits

Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…

Kioxia Discontinues 2D NAND & 3rd-Gen BiCS 3D NAND | Latest Flash Memory News

Apr 3, 2026

Kioxia Officially Announces Phase-Out of Legacy 2D NAND and Third-Generation BiCS 3D NAND, Marking End of an Era in Flash Memory

TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…

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Recent News

OpenAI Reaches Preliminary Agreement with Samsung and SK Hynix to Supply Chips for the “Stargate” Project

Rocker switch selection: ratings, illumination and panel fit

Vishay Announces 8%-12% Price Hike for MOSFETs and ICs Amid Rising Raw Material Costs

Renesas Electronics to Phase Out Takasaki Factory Manufacturing in 2–3 Years (R&D Preserved)

Allegro MicroSystems Announces Global Price Adjustments for All Product Lines Effective April 27, 2026

Logic inverter IC guide: truth tables and voltage levels

What Is an IMU? Sensors, Axes and Applications

Infineon Announces Price Increase: Power Device Prices to Rise Effective April 1, Driven by Surging AI Demand and Mounting Cost Pressures

DIP switch guide: types, positions and PCB configuration

How Does a Gyroscope Work? MEMS Principles and Selection

The Trends of Modularization for Embedded Integrated Circuits

Kioxia Officially Announces Phase-Out of Legacy 2D NAND and Third-Generation BiCS 3D NAND, Marking End of an Era in Flash Memory

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