SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Connectors of this type have contacts arranged in linear rows and an outline which is generally rectangular, rather than circular. They are used for creating pluggable connections directly between printed circuit boards without use of wire or cable, and can provide a large number of electrical connections in a relatively small space. For this reason they are commonly used to connect components of space-constrained systems.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Amphenol ICC (FCI) | CONN RCPT 120POS SMD GOLD | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | BergStak® 0.80mm | |||
![]() 61082-122600LF $2.74 | Amphenol ICC (FCI) | CONN RCPT 120POS SMD GOLD | Tube | Surface Mount | BergStak® 0.80mm | ||
![]() 61082-122602LF $3.81 | Amphenol ICC (FCI) | CONN RCPT 120POS SMD GOLD | Tape & Reel (TR) | Surface Mount | BergStak® 0.80mm | ||
![]() 61082-122602PLF $1.54 | Amphenol ICC (FCI) | CONN RCPT 120POS SMD GOLD | Tape & Reel (TR) | Surface Mount | BergStak® 0.80mm | ||
| Amphenol ICC (FCI) | CONN RCPT 120POS SMD GOLD | Tape & Reel (TR) | Surface Mount | BergStak® 0.80mm | |||
![]() 61082-122702LF $1.78 | Amphenol ICC (FCI) | CONN RCPT SMD GOLD | Tape & Reel (TR) | Surface Mount | BergStak® 0.80mm | ||
![]() 61082-122B02LF $2.73 | Amphenol ICC (FCI) | 0.8MM BTB REC ASSY-61082-122B02L | Tape & Reel (TR) | Surface Mount | BergStak® 0.80mm | ||
![]() 61082-123000 $3.14 | Amphenol ICC (FCI) | CONN RCPT 120POS SMD GOLD | Tube | Surface Mount | BergStak® 0.80mm |
1658050-1View Product
61082-083002View Product
539160408View Product
QMSS-048-06.75-L-D-DP-A-K-TRView Product
QFS-026-01-SL-D-RA-PC8View Product
WR-FL70P-VF50-N1View Product
ERF6-20-03.5-S-DV-A-K-TRView Product
FX11A-60S/6-SV(71)View Product
BTH-100-02-F-D-AView Product
145077040110861+View Product
SLH-010-1.50-G-D-KView Product
AXT680124View Product
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
If you’ve spent any time staring at a schematic, you’ve seen the triangle. Two inputs, one output, and a gain symbol that looks deceptively…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More