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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in the modular embedded processor family integrate a microcontroller, microprocessor, digital signal processor, FPGA, or other such computational device together with support components such as memory, power management, timing, and other items necessary for their operation. They are suitable and intended for integration into an end product, and offer product developers access to modern computational and interface capabilities without necessity of high speed hardware design experience.
20-101-1246View Product
TE0722-02IView Product
TE0808-05-9BE21-LView Product
FS-373View Product
TE0726-03RJView Product
TE0712-02-200-2CView Product
TE0720-04-61C530AView Product
CC-WMX-LD79-QTC1View Product
TE0808-04-6BE21-AKView Product
20-101-0522View Product
DC-ME-Y413-LX-BView Product
iW-G57M-2302-4L004G-E016G-BEBView Product
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
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Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
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Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read MoreWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
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Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
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The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
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TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
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Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
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Selecting the right microcontroller (MCU) isn’t just about specs—it’s about balancing performance, power, cost, and supply chain reliability. As an engineer, you’ve probably faced…
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Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
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See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
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