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Specialty Logic ICs are designed to provide an application specific logic output type such as BCD rate multiplication, addressable scan port, bus termination array, CML driver, comparator, ABT scan test, binary full adder, complimentary pair plus inverter, configurable buffer, contact bounce eliminator, crystal oscillator, delay element, differential receiver, LVTTL-to-GTLP transceiver, memory decoder, power good detector, and frequency divider.

On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
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Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
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As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
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Explore electronic component types, functions, packages and datasheets. Learn selection, replacement and BOM checks before ordering parts for your PCB.
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Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
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Understand voltage controlled oscillator tuning, phase noise and PLL operation. Check supply noise, output loading and requirements before selection.
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Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
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The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
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Choose an ADC converter by resolution, sample rate, noise and input design. Review practical tradeoffs and prepare component requirements for ChipApex.
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Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
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Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
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