SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in this family are interconnect products used in conjunction with Flat Flexible Cable (FFC) and Flexible Printed Circuit (FPC) materials and are predominantly of the sort which perform a cable-to-board interconnect function, being mounted to a printed circuit board, and providing both electrical connection and mechanical retention for an inserted FFC or FPC cable.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 5051102091 $0.72 | Molex | CONN FFC BOTTOM 20POS 0.5MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | Easy-On FD19 505110 | -40°C ~ 105°C | |
![]() 5051102096 $0.78 | Molex | CONN FFC BOTTOM 20POS 0.5MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | Easy-On FD19 505110 | -40°C ~ 125°C | |
![]() 5051102191 $2.04 | Molex | CONN FFC BOTTOM 21POS 0.5MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | Easy-On FD19 505110 | -40°C ~ 105°C | |
![]() 5051102196 $1.58 | Molex | CONN FFC BOTTOM 21POS 0.5MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | Easy-On FD19 505110 | -40°C ~ 150°C | |
![]() 5051102291 $0.76 | Molex | CONN FFC BOTTOM 22POS 0.5MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | Easy-On FD19 505110 | -40°C ~ 105°C | |
![]() 5051102296 $0.83 | Molex | CONN FFC BOTTOM 22POS 0.5MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | Easy-On FD19 505110 | -40°C ~ 125°C | |
![]() 5051102391 $2.12 | Molex | CONN FFC BOTTOM 23POS 0.5MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | Easy-On FD19 505110 | -40°C ~ 105°C | |
![]() 5051102396 $1.65 | Molex | CONN FFC BOTTOM 23POS 0.5MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | Easy-On FD19 505110 | -40°C ~ 150°C |

An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read MoreWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More
Learn what an integrated circuit is, how ICs work, the main types and the specs to check before choosing a part for your design…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More