SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

A Field Programmable Gate Array (FPGA) is a programmable integrated circuit that allows users to implement customized hardware logic configurations after manufacturing. FPGAs are user-configurable and are widely used for performing logical operations and information processing, often in applications demanding real-time performance and extremely high speeds. With a very high level of integrated functionality, FPGAs can replace general-purpose microprocessors in systems where known operations—such as receiving and processing data from high-speed data converters—need to be executed rapidly and deterministically. Unlike fixed-function chips, FPGAs are reprogrammable, meaning they can be configured multiple times using hardware description languages like Verilog. At the heart of an FPGA are configurable logic blocks (CLBs), programmable interconnects, logic gates, and flip-flops, which are organized into a flexible architecture called a gate array. These components support complex logic creation, digital signal processing, and extensive parallel processing. Typically, FPGAs require an external memory device—often flash memory or read-only storage—to hold the configuration data and reload it upon each startup. This makes them particularly well-suited for telecommunications, data center infrastructure, and advanced embedded systems where both performance and low power consumption are critical. FPGAs serve as a software-defined hardware platform, allowing designers to build custom processor logic or accelerate functions beyond what a typical microcontroller can handle. The flexibility to reconfigure them makes FPGAs a key technology for prototyping, evolving product designs, and deploying real-time hardware solutions.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Altera | IC FPGA 840 I/O 1932FBGA | Tray | 1932-FBGA, FC (45x45) | Surface Mount | Stratix® V GX | 0°C ~ 85°C (TJ) | |
| Altera | IC FPGA 840 I/O 1932FBGA | Tray | 1932-FBGA, FC (45x45) | Surface Mount | Stratix® V GX | 0°C ~ 85°C (TJ) | |
| Altera | IC FPGA 840 I/O 1932FBGA | Tray | 1932-FBGA, FC (45x45) | Surface Mount | Stratix® V GX | 0°C ~ 85°C (TJ) | |
![]() 5SGXMA5N3F45C3G $9,369.37 | Altera | IC FPGA 840 I/O 1932FBGA | Tray | 1932-FBGA, FC (45x45) | Surface Mount | Stratix® V GX | 0°C ~ 85°C (TJ) |
| Altera | IC FPGA 840 I/O 1932FBGA | Tray | 1932-FBGA, FC (45x45) | Surface Mount | Stratix® V GX | 0°C ~ 85°C (TJ) | |
| Altera | IC FPGA 840 I/O 1932FBGA | Tray | 1932-FBGA, FC (45x45) | Surface Mount | Stratix® V GX | 0°C ~ 85°C (TJ) | |
![]() 5SGXMA5N3F45C4G $7,495.16 | Altera | IC FPGA 840 I/O 1932FBGA | Tray | 1932-FBGA, FC (45x45) | Surface Mount | Stratix® V GX | 0°C ~ 85°C (TJ) |
| Altera | IC FPGA 840 I/O 1932FBGA | Tray | 1932-FBGA, FC (45x45) | Surface Mount | Stratix® V GX | 0°C ~ 85°C (TJ) |
XCVU13P-1FHGB2104EView Product
5SGXMA3H1F35I2NView Product
EP3SL340F1517C3GView Product
5AGXMB3G4F31C5GView Product
5CGXFC4F6M11I7NView Product
5SGXEA9K3H40C2LView Product
10AX115N4F45I3LGView Product
A54SX16A-FGG144AView Product
1SG040HH1F35E2LGView Product
EP4SGX230FF35C4NView Product
EPF10K200EGC599-1View Product
5SGSMD5K2F40I3LView Product
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More