SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

This type of header (receptacle) contains female sockets within a plastic housing and is meant to be mated with a rectangular cable connector or a male pin header for board-to-board connection. These come in a variety of position and pitch options, with some having a breakaway option to manually change position count with ease. Mounting types include panel mount, board edge, stacking, surface mount, and through-hole.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 310-44-138-41-001000 $10.65 | Mill-Max Manufacturing Corp. | CONN RCPT 38POS 0.1 TIN PCB | Bulk | Through Hole | 310 | -55°C ~ 125°C | |
| Mill-Max Manufacturing Corp. | CONN RCPT 38POS 0.1 TIN PCB | Bulk | Through Hole | 310 | -55°C ~ 125°C | ||
![]() 310-44-139-41-001000 $10.72 | Mill-Max Manufacturing Corp. | CONN RCPT 39POS 0.1 TIN PCB | Bulk | Through Hole | 310 | -55°C ~ 125°C | |
| Mill-Max Manufacturing Corp. | CONN RCPT 39POS 0.1 TIN PCB | Bulk | Through Hole | 310 | -55°C ~ 125°C | ||
![]() 310-44-140-41-001000 $10.46 | Mill-Max Manufacturing Corp. | CONN RCPT 40POS 0.1 TIN PCB | Tube | Through Hole | 310 | -55°C ~ 125°C | |
| Mill-Max Manufacturing Corp. | CONN RCPT 40POS 0.1 TIN PCB | Bulk | Through Hole | 310 | -55°C ~ 125°C | ||
![]() 310-44-141-41-001000 $10.60 | Mill-Max Manufacturing Corp. | CONN RCPT 41POS 0.1 TIN PCB | Bulk | Through Hole | 310 | -55°C ~ 125°C | |
| Mill-Max Manufacturing Corp. | CONN RCPT 41POS 0.1 TIN PCB | Bulk | Through Hole | 310 | -55°C ~ 125°C |
CLP-144-02-STL-DView Product
SMM-116-01-L-SView Product
HLE-116-02-L-DV-BE-K-TRView Product
ESQ-125-39-S-TView Product
CLT-146-02-H-D-BEView Product
CLE-108-01-F-DV-PView Product
SL-112-T-12View Product
310-83-124-01-754101View Product
803-87-018-10-216101View Product
ESQT-110-02-M-D-732View Product
WG104SAD9SY-3View Product
93696-315LFView Product
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
Recently, the global electronic component market has witnessed complex and changeable trends. In the memory chip sector, the wave of price increases continues to…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read MoreA digital-to-analog converter (DAC) turns a digital number into an analog voltage or current. It lets a controller set a physical output, such as…
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More
Choose an AC to DC converter by input range, output demand, isolation, efficiency and thermal derating. Compare architectures and check installation needs.
Read More
Recently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological…
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More